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MAX6656MEE Rev. A
RELIABILITY REPORT FOR MAX6656MEE PLASTIC ENCAPSULATED DEVICES
February 3, 2004
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR. SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord Quality Assurance Reliability Lab Manager
Bryan J. Preeshl Quality Assurance Executive Director
Conclusion The MAX6656 successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards. Table of Contents I. ........Device Description II. ........Manufacturing Information III. .......Packaging Information IV. .......Die Information V. ........Quality Assurance Information VI. .......Reliability Evaluation ......Attachments
I. Device Description A. General The MAX6656 is a precise voltage and temperature monitor. The digital thermometer reports the temperature of two remote sensors and its own die temperature. The remote sensors are diode-connected transistors--typically a lowcost, easily mounted 2N3906 PNP type--that replace conventional thermistors or thermocouples. Remote accuracy is 1C for multiple transistor manufacturers with no calibration necessary. The remote channels can also measure the die temperature of other ICs, such as microprocessors, that contain a substrate-connected PNP with its collector grounded and its base and emitter available for temperature-sensing purposes. The temperature is digitized with 11-bit resolution. The MAX6656 also measure it's own supply voltage and three external voltages with 8-bit resolution. Each voltage input's sensitivity is set to give approximately 3/4-scale output code when the input voltage is at its nominal value. The MAX6656 operates on a +3.3V supply and its second voltage monitor is 5V. The 2-wire serial interface accepts standard SMBusTM Write Byte, Read Byte, Send Byte, and Receive Byte commands to program the alarm thresholds and to read data. The MAX6656 also provide SMBus alert response and timeout functions. The MAX6656 measures automatically and autonomously, with the conversion rate programmable. The adjustable rate allows the user to control the supply current. In addition to the SMBus ALERT -bar output, the MAX6656 features an OVERT -bar output, which is used as a temperature reset that remains active only while the temperature is above the maximum temperature limit. The OVERT-bar output is optimal for fan control or for system shutdown. B. Absolute Maximum Ratings Item VCC to GND DXN_ to GND SMBCLK, SMBDATA, ALERT, STBY, OVERT to GND VIN1 to GND VIN2 to GND VIN3 to GND All Other Pins to GND SMBDATA, ALERT, OVERT Current DXN_ Current Operating Temperature Range Junction Temperature Storage Temperature Range Lead Temperature (soldering, 10s) Continuous Power Dissipation (+70C) 16-Pin QSOP Derates above +70C 16-Pin QSOP Rating -0.3V to +6V -0.3V to +0.8V -0.3V to +6V -0.3V to +16V -0.3V to +6V -0.3V to +6V -0.3V to (VCC + 0.3V) -1mA to +50mA 1mA -55C to +125C +150C -65C to +150C +300C 667mW 8.3mW/C
II. Manufacturing Information A. Description/Function: Dual Remote/Local Temperature Sensors and Four-Channel Voltage Monitors B. Process: C. Number of Device Transistors: D. Fabrication Location: E. Assembly Location: F. Date of Initial Production: B8 (Standard 0.8 micron silicon gate CMOS) 26,783 California, USA Thailand or Philippines July, 2001
III. Packaging Information A. Package Type: B. Lead Frame: C. Lead Finish: D. Die Attach: E. Bondwire: F. Mold Material: G. Assembly Diagram: H. Flammability Rating: I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: 16-Lead QSOP Copper Solder Plate Silver-Filled Epoxy Gold (1 mil dia.) Epoxy with silica filler Buildsheet # 05-2901-0011 Class UL94-V0
Level 1
IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G. Bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 86 x 144 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Copper/Si None .8 microns (as drawn) .8 microns (as drawn) 5 mil. Sq. SiO2 Wafer Saw
V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord (Manager, Reliability Operations) Bryan Preeshl (Executive Director of QA) Kenneth Huening (Vice President) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135C biased (static) life test are shown in Table 1. Using these results, the Failure Rate () is calculated as follows: = 1 = MTTF 1.83 (Chi square value for MTTF upper limit) 192 x 4389 x 239 x 2 Temperature Acceleration factor assuming an activation energy of 0.8eV = 4.54 x 10-9 = 4.54 F.I.T. (60% confidence level @ 25C)
This low failure rate represents data collected from Maxim's reliability qualification and monitor programs. Maxim also performs weekly Burn-In on samples from production to assure reliability of its processes. The reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on rejects from lots exceeding this level. The attached Burn-In Schematic (Spec. # 06-5744) shows the static circuit used for this test. Maxim also performs 1000 hour life test monitors quarterly for each process. This data is published in the Product Reliability Report (RR1M). B. Moisture Resistance Tests Maxim evaluates pressure pot stress from every assembly process during qualification of each new design. Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85C/85%RH or HAST tests are performed quarterly per device/package family. C. E.S.D. and Latch-Up Testing The TS06-1 die type has been found to have all pins able to withstand a transient pulse of 1500V, per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of 250mA.
Table 1 Reliability Evaluation Test Results MAX6656MEE
TEST ITEM TEST CONDITION FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES
Static Life Test (Note 1) Ta = 135C Biased Time = 192 hrs. Moisture Testing (Note 2) Pressure Pot Ta = 121C P = 15 psi. RH= 100% Time = 168hrs. Ta = 85C RH = 85% Biased Time = 1000hrs.
DC Parameters & functionality
239
0
DC Parameters & functionality
100
0
85/85
DC Parameters & functionality
77
0
Mechanical Stress (Note 2) Temperature Cycle -65C/150C 1000 Cycles Method 1010 DC Parameters 77 0
Note 1: Life Test Data may represent plastic DIP qualification lots. Note 2: Generic package/process data.
Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/
Terminal A (Each pin individually connected to terminal A with the other floating) 1. 2. All pins except VPS1 3/ All input and output pins
Terminal B (The common combination of all like-named pins connected to terminal B) All VPS1 pins All other input-output pins
1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 a. b. Pin combinations to be tested. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., V , or V SS1 SS2 or V SS3 or V CC1 , or V CC2 ) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open.
c.
TERMINAL C
R1 S1 R2
TERMINAL A REGULATED HIGH VOLTAGE SUPPLY
S2 C1
DUT SOCKE T
SHORT CURRENT PROBE (NOTE 6)
TERMINAL B Mil Std 883D Method 3015.7 Notice 8
TERMINAL D
R = 1.5k C = 100pf
ONCE PER SOCKET
100 OHMS
ONCE PER BOARD +5.5V
10K
10K 10K 10K 0.1pF
1 2
PNP390 6 IN 10
16 15 14
3 4 5 6
+12V
13 12 11 10 9
14.4K 26K
9.6K
24K
PNP390 6 IN 10
7 8
16 PIN-QSOP
10K
DEVICES: MAX 6655/6656 MAX. EXPECTED CURRENT = 5mA
DRAWN BY: HAK TAN NOTES:
DOCUMENT I.D. 06-5744
REVISION A
MAXIM
TITLE: BI
Circuit (MAX6655/6656)
PAGE
2
OF 3

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